Robert Weigel

Prof. Dr.-Ing. Dr.-Ing. habil. Robert Weigel

Professor im Ruhestand

Department of Electrical-Electronic-Communication Engineering
Institute for Smart Electronics and Systems

Room: Raum 04.231
Cauerstraße 9
91058 Erlangen

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About Robert Weigel

Born in Ebermannstadt (Bavaria), Robert Weigel studied Microwave Theory and Techniques at the Munich University of Technology, where he also received his Ph.D. with a work dealing with „Integrated Acoustooptic Light Deflectors“ and his habilitation with a work on „Surface Acoustic Wave Devices at UHF Frequencies.“ Then he founded the Institute for Communications and Information Technology at the University in Linz before he overtook the vacant Institute for Electronics Engineering (LTE) in Erlangen. His curriculum covering RF Microwaves in Munich, Communications in Linz, and Electronics Engineering in Erlangen has broken the ground for the breadth of the LTE. During his time in Munich, he established ties with Siemens in the Microwave Acoustic (since 1984) and in the Integrated RF Circuits arena (since 1994), which are still active today; of course, the partner today is no more Siemens since several electronics companies were carved out. During his time in Linz, he co-founded DICE (Danube Integrated Circuit Engineering), from which later two companies arose due to takeovers by Infineon and Intel (recently overtaken by Apple), and which all together today have over 400 staff members. In Erlangen, he co-founded eesy-ic with today over 60 staff members.

Courses

Lecture (VORL)

Other courses (SL)

Seminar (SEM)

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Awards

  • , , , , , : Best Paper Award "Integrated System-on-Module for Design-Space Exploration of Spiking Neural Networks" (IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS 2023)) – 2023

  • : Verdienstkreuz 1. Klasse des Verdienstordens der Bundesrepublik Deutschland (Bundesrepublik Deutschland) – 2022
  • : Verdienstkreuz 1. Klasse des Verdienstordens der Bundesrepublik Deutschland – 2022

  • : 2020 IEEE Microwave Career Award (IEEE Microwave Theory and Techniques Society (MTT-S)) – 2020

  • , , , : RWW Student Paper Competition, 2nd place (IEEE Radio and Wireless Week) – 2019
  • , , : Radio Wireless Week Student Paper Competition, 1st Place (IEEE) – 2019
  • , , , , , , : 5G World Forum Best Paper Award (IEEE 2nd 5G World Forum and IEEE 4th 5G Summit Dresden) – 2019

  • , , , , , , : RWW Student Paper Competition, 3rd place (IEEE Radio and Wireless Week) – 2018
  • , , , , : Best Paper Award - "An acoustic emmission sensor system for thin layer crack detection" (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis) – 2018
  • : ITG-Fellow (Informationstechnischen Gesellschaft (ITG) im VDE) – 2018
  • : IEEE Rudolf Henning Distinguished Mentoring Award (Institute of Electrical and Electronics Engineers (IEEE)) – 2018
  • : EuMA Distinguished Service Award 2018 (European Microwave Association (EuMA)) – 2018

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Patents

  • (Priority Patent Application: EP 0878064 B1)
    Inventor(s): ,

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Publications


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