Vikrant Chauhan
Dr.-Ing. Vikrant Chauhan
Vikrant Chauhan received a Master of Science in Electrical Engineering from Friedrich-Alexander-Universität Erlangen-Nürnberg in 2015 and a PhD in Electrical Engineering from the University of Bayreuth in 2021. He joined Qualcomm Munich in 2018. Vikrant Chauhan was nominated for the Student Paper Award at the IEEE Asia Pacific Microwave Conference 2016, he was a finalist and winner of the Student Paper Award at the IEEE International Ultrasonic Symposium 2016 and 2017, respectively. He was also a recipient of the IEEE Microwave Theory and Techniques Society Graduate Fellowship for the year 2018. His research interests include BAW physics, nonlinear modeling of BAW and SAW devices, RF front-ends, and power amplifier module designs. He is a member of IEEE and Springer.